Thinning grinding wheel

Specifically designed for the precision thinning of semiconductor wafers (such as silicon and silicon carbide). The product boasts a comprehensive range of specifications, enabling efficient material removal while minimizing subsurface damage to the greatest extent possible, thereby achieving outstanding processing accuracy and extended tool life.

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  • Phone:0571-86129869

    Email:xinyanke@dxinyan.com

    Address: Building 1, 1st Floor, No. 516 Shunfeng Road, Linping Subdistrict, Linping District, Hangzhou City, Zhejiang Province

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