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Product Introduction
It features high machining precision and narrow cutting seams, making it suitable for silicon wafers, oxide wafers, and various compound wafers such as silicon carbide, gallium arsenide, and gallium phosphide.
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Phone:0571-86129869
Email:xinyanke@dxinyan.com
Address: Building 1, 1st Floor, No. 516 Shunfeng Road, Linping Subdistrict, Linping District, Hangzhou City, Zhejiang Province