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PRODUCT
Committed to integrated LGP product solutions for the semiconductor industry.
Specifically designed for the precision thinning of semiconductor wafers (such as silicon and silicon carbide). The product boasts a comprehensive range of specifications, enabling efficient material removal while minimizing subsurface damage to the greatest extent possible, thereby achieving outstanding processing accuracy and extended tool life.
Specifically designed for precise shaping and polishing of wafer edges, this tool effectively removes sharp edges and microcracks at the wafer’s periphery, enhancing mechanical strength and preventing stress concentrations and chipping during subsequent processing steps. It is a critical tool for ensuring high yield rates.
The dressing tools—such as thinning wheels and edge-beveling wheels—that are used in conjunction with grinding wheels can efficiently dress surfaces, restoring their performance and flatness. These tools are crucial for maintaining a stable grinding rate and ensuring high product quality and consistency.
Specifically designed for processing semiconductor wafers, packaging substrates, and various hard and brittle materials. With its exceptional cutting precision, it delivers outstanding cross-sectional quality while maintaining high stability and longevity.
A high-performance nanoscale polishing slurry specifically designed for the semiconductor wafer CMP process. Through the synergistic action of unique chemical etching and mechanical abrasion, it achieves precise material removal at the nanoscale, enabling global planarization of wafers.
Contact Us
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Phone:0571-86129869
Email:xinyanke@dxinyan.com
Address: Building 1, 1st Floor, No. 516 Shunfeng Road, Linping Subdistrict, Linping District, Hangzhou City, Zhejiang Province