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Product Introduction:
A 12-inch silicon wafer double-sided grinding wheel, specially designed to meet the core requirements of efficient and high-precision thinning and surface planarization for large-size silicon wafers. Featuring high-purity synthetic diamond as the primary abrasive material, combined with a ceramic bond, this wheel strikes an optimal balance between efficiency and grinding quality.
Product features:
- High-thinning precision: Utilizing ultra-fine diamond abrasives combined with a uniform ceramic binder, this process achieves a TTV of silicon wafers ≤1 and a bow/Bf within ±4, meeting the micrometer-level thinning requirements for semiconductor silicon wafers.
- High-efficiency grinding capability: Optimized abrasive particle distribution density, combined with a high wheel peripheral speed design, boosts silicon wafer thinning efficiency by 30% to 50%.
- Long service life: The abrasive material has undergone special treatment to enhance its wear resistance, and the bond between the binder and the abrasive is exceptionally strong, ensuring an outstanding service life with uniform wear characteristics. No frequent dressing is required throughout the entire service period.
- Suitable for simultaneous double-sided machining: The grinding wheel features a symmetry tolerance of ≤0.02 mm, making it ideal for synchronous grinding operations on both sides of silicon wafers. This ensures consistent thinning on both the front and back sides of the wafer, thereby preventing warping caused by uneven stress distribution on a single side.
Product Specifications:
XA-I-6A2-160*27*80*3.4*5 D2000#
XC-Ⅰ-6A2-160*27*80*3.4*5 D3000#
XB-Ⅰ-6A2-160*27*80*3.4*5 D4000#
Product Application:
Applicable to grinding machines such as the Japanese KOYO and DXSG series, customizable according to customer requirements.
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Phone:0571-86129869
Email:xinyanke@dxinyan.com
Address: Building 1, 1st Floor, No. 516 Shunfeng Road, Linping Subdistrict, Linping District, Hangzhou City, Zhejiang Province