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Chamfering grinding wheel

Specifically designed for precise shaping and polishing of wafer edges, this tool effectively removes sharp edges and microcracks at the wafer’s periphery, enhancing mechanical strength and preventing stress concentrations and chipping during subsequent processing steps. It is a critical tool for ensuring high yield rates.

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0571-86129869

Email: xinyanke@dxinyan.com

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Phone:0571-86129869

Email:xinyanke@dxinyan.com

Address: Building 1, 1st Floor, No. 516 Shunfeng Road, Linping Subdistrict, Linping District, Hangzhou City, Zhejiang Province

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