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Product Introduction ：
This product is specially designed for the rough polishing process of silicon carbide substrates and is suitable for a variety of customized processes, including single-sided and double-sided polishing of silicon carbide wafers ranging from 4 inches to 12 inches.
Product Features ：
High removal rate, low surface roughness after polishing, and no new damage generated after polishing.
- Nano-alumina abrasive with a uniform particle size distribution.
- Potassium permanganate strong oxidation system, enhancing removal efficiency.
- Dedicated dispersant ensuring long-term stability
- Weakly alkaline formulation reduces equipment corrosion.
Technical Specifications ：
- Alumina suspension containing the KMnO₄ oxidizing agent
- Particle size: 200–350 nanometers
- Solid content: 7%
- pH: 7–10
SEM image of abrasive material
Particle Size Distribution Chart
Post-processed AFM image
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Contact Us
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Phone:0571-86129869
Email:xinyanke@dxinyan.com
Address: Building 1, 1st Floor, No. 516 Shunfeng Road, Linping Subdistrict, Linping District, Hangzhou City, Zhejiang Province