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Product types:
- Silicon Carbide Rough/Finishing Grinding Wheel
- Silicon Rough/Finishing Grinding Wheel
- Germanium wafer/Gallium arsenide/Indium phosphide thinning grinding wheel
- Lithium Niobate/Lithium Tantalate Thinning Grinding Wheel
Product Introduction:
The diamond grinding wheel, specially designed for ultra-precise thinning of semiconductor wafers, integrates materials science and advanced manufacturing processes to enable highly efficient, ultra-precise, and low-damage wafer thinning.
Product features:
By offering a wide range of metal, resin, and ceramic bond systems, as well as various diamond grit sizes and concentrations, we can meet diverse grinding requirements—from rough grinding to fine grinding. Thanks to their excellent self-sharpening properties, chip-carrying capacity, and heat dissipation performance, these products achieve outstanding wear resistance, extremely low total thickness variation (TTV), and superior surface roughness (Ra).
Electron micrograph of the grinding wheel
Photograph of wafer roughness inspection after thinning
Wafer mirror photo after thinning
Product Specifications:
Target audience:
It is compatible with various models of equipment from Disco, Tokyo Seimitsu, Okamoto, TST, JingSheng, CETC, and others.
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Contact Us
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Phone:0571-86129869
Email:xinyanke@dxinyan.com
Address: Building 1, 1st Floor, No. 516 Shunfeng Road, Linping Subdistrict, Linping District, Hangzhou City, Zhejiang Province