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Product types:
- Silicon TK Rough/Finish Grinding Wheel
- Silicon Carbide TK Rough/Finish Grinding Wheel
Product Introduction:
By adopting a unique geometric shape and machining path design, efficient grinding of the internal regions of wafers is achieved, enabling stable mass production of ultra-thin wafers.
Product features:
Thanks to its specially designed contour and superior grinding performance, the TK thinning equipment efficiently thins the central region of wafers while leveraging the retained outer-edge support ring to ensure the overall strength of ultra-thin wafers, significantly reducing the risk of chipping and deformation. The processed wafer thickness and ring width remain consistently stable, and the grinding tool has a long service life.
Wafer appearance after thinning
Product Specifications:
Target audience:
Suitable for mainstream TK thinning machines on the market.
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Contact Us
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Phone:0571-86129869
Email:xinyanke@dxinyan.com
Address: Building 1, 1st Floor, No. 516 Shunfeng Road, Linping Subdistrict, Linping District, Hangzhou City, Zhejiang Province