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LED Industry
Light up the brilliance of a colorful life
LED industry (silicon, sapphire, gallium arsenide, etc.)
LED industry (silicon, sapphire, gallium arsenide, etc.)
Shine a light on the brilliance of a colorful life.
From indoor lighting to outdoor displays, from car headlights to smartphone flashlights, LED technology is ubiquitous. These LED chips are grown on a variety of hard and brittle substrates, such as sapphire, silicon, and gallium arsenide.
Why does thinning the substrate or back side affect light efficiency?
Enhancing Light Extraction Efficiency: A substrate that is too thick can absorb and scatter light. Thinning the substrate—especially sapphire—can significantly reduce light loss, thereby improving the brightness and light-emitting efficiency of LEDs.
Improving Voltage Characteristics: For silicon-substrate LEDs, thinning the substrate can reduce the series resistance, thereby lowering the operating voltage and enhancing energy efficiency.
Facilitates subsequent dicing and packaging: Thinner wafers are easier to laser scribe or mechanically dicer, improving the yield and precision of chip separation.
Incorporated in Hong Kong with Limited Liability
Hangzhou Xin Yan Ke’s technological advantages
From silicon to silicon carbide, from wafers to substrates, we leverage cutting-edge technology to inject outstanding competitiveness into your thinning processes.
01
Material-specific formulation
We have tailored grinding wheel formulations specifically for the easy cleavage properties of gallium arsenide, the varying resistivity of silicon, and the ultra-high hardness of sapphire, ensuring optimal machining performance.
02
Excellent surface consistency
We ensure that the thinned LED wafers exhibit exceptional thickness uniformity and surface smoothness, providing an ideal platform for processes such as vapor deposition and photolithography, thereby guaranteeing uniform light emission and consistent performance across every LED chip.
03
High economic efficiency
To meet the large-scale production demands of the LED industry, our grinding wheels not only ensure superior processing quality but also focus on cost optimization, providing you with the most competitive overall manufacturing costs.
Diamond particle shape inspection
Element Distribution Analysis
1
LED wafer
2
Fine grinding and thinning
3
Fine grinding and thinning
4
Wafer dicing
5
Chip mounting
6
Wire bonding
7
Molded plastic encapsulation
Contact Us
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Phone:0571-86129869
Email:xinyanke@dxinyan.com
Address: Building 1, 1st Floor, No. 516 Shunfeng Road, Linping Subdistrict, Linping District, Hangzhou City, Zhejiang Province