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Cutting tool

Specifically designed for processing semiconductor wafers, packaging substrates, and various hard and brittle materials. With its exceptional cutting precision, it delivers outstanding cross-sectional quality while maintaining high stability and longevity.

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0571-86129869

Email: xinyanke@dxinyan.com

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Cutting tool

Wafer dicing blade

Cutting tool

Encapsulation cutting blade

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Phone:0571-86129869

Email:xinyanke@dxinyan.com

Address: Building 1, 1st Floor, No. 516 Shunfeng Road, Linping Subdistrict, Linping District, Hangzhou City, Zhejiang Province

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