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Other Semiconductors
Unlimited Possibilities of Cutting-edge Technology
Other semiconductor hard and brittle materials (grinding)
Other Semiconductor Hard and Brittle Materials (Grinding)
The limitless possibilities of cutting-edge technology
In addition to silicon, germanium, gallium arsenide, and silicon carbide, there are numerous other hard and brittle materials such as gallium nitride, indium phosphide, quartz, ceramics, and glass. These materials are essential components of advanced technology products—including 5G RF devices, lasers, sensors, and microelectromechanical systems.
Why precision grinding is a common need?
These materials typically exhibit high value, high hardness, and high brittleness; any damage incurred during the manufacturing process can lead to failure of device performance. Precision grinding is a critical manufacturing step for achieving the specified dimensions, shape, and surface integrity of these materials.
Incorporated in Hong Kong with Limited Liability
Hangzhou Xin Yan Ke’s technological advantages
From silicon to silicon carbide, from wafers to substrates, we leverage cutting-edge technology to inject outstanding competitiveness into your thinning processes.
01
Strong customized R&D capabilities
We don’t rely on “off-the-shelf solutions” to address “special needs.” Our team of engineers can quickly develop and customize the most suitable grinding wheel solutions tailored to your specific material properties, equipment conditions, and final product requirements.
02
Extensive technical platform portfolio
We have deep technical expertise in binder systems such as ceramics and resins, as well as in diamond and CBN abrasives, enabling us to offer the optimal solutions for a wide variety of unconventional material combinations.
03
Together with you, we’ll overcome technical challenges.
We see ourselves as an extension of your team in the field of precision manufacturing. Faced with the processing challenges posed by new hard and brittle materials, we’re delighted to collaborate with you in conducting research, testing, and optimization—working together until we’ve found a stable and reliable mass-production solution.
In the pursuit of the ultimate microcosm, we provide the macroscopic forces that determine success or failure. Choosing us means selecting a deep partner dedicated to thinning technology. Contact us today to tailor a customized solution for your specific application.
1
Crystal rod/crystal ingot
2
Multi-wire cutting
3
Multi-wire cutting
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Coarse grinding and thinning
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Fine grinding and thinning
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Polishing
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Finished polished sheet
Contact Us
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Phone:0571-86129869
Email:xinyanke@dxinyan.com
Address: Building 1, 1st Floor, No. 516 Shunfeng Road, Linping Subdistrict, Linping District, Hangzhou City, Zhejiang Province