Product Introduction:
Xinyanke offers two types of chamfering grinding wheels—metal-bonded and resin-bonded—which feature high precision, excellent machining quality, and stable shape retention. We can manufacture chamfering grinding wheels of various sizes, numbers of slots, and slot profiles according to customer requirements, thereby meeting customers’ demands for high precision and superior surface quality.
Product usage:
Suitable for peripheral chamfering of semiconductor wafers made of silicon carbide, silicon, germanium, sapphire, gallium arsenide, lithium tantalate, and other materials.
Product features:
| Binder | Granularity | Grinding wheel outer diameter |
| Metal | 600#-2000# | Ø102, Ø150, Ø202 |
| Resin | 1500#-3000# | Ø50, Ø202 |
Groove type:
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| Type R | T-shaped |
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