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silicon substrate
The cornerstone of the intelligent world
Silicon substrate (wafer) thinning
Thinning of silicon substrates (silicon wafers)
The cornerstone of the intelligent world
The chips—the “brains” at the heart of the smartphone in your hand, the smart car you’re driving, and the cloud computing services you use—are overwhelmingly built on silicon substrates. Silicon serves as the “foundation” for manufacturing integrated circuits, and its flatness and quality directly determine the performance of the chips.
After undergoing front-end processes, silicon substrates need to be thinned to meet the final chip thickness requirements. Precise thinning can:
Enhancing chip performance: Thinner chips mean shorter electrical pathways, faster signal transmission, lower power consumption, and improved heat dissipation.
Meeting packaging requirements: Modern electronic devices strive for lightness, thinness, shortness, and compactness; reducing thickness is a prerequisite for achieving high-density packaging (such as 3D ICs).
Enhancing mechanical strength and yield: Controlling stress and microcracks during thinning is crucial for ensuring that the chip does not fracture during subsequent processing steps.
Incorporated in Hong Kong with Limited Liability
Hangzhou Xin Yan Ke’s technological advantages
From silicon to silicon carbide, from wafers to substrates, we leverage cutting-edge technology to inject outstanding competitiveness into your thinning processes.
01
Exceptional flatness control
Our unique grinding wheel formulation and product manufacturing process ensure sub-micron-level flatness across the entire substrate surface, laying a perfect foundation for subsequent processes such as photolithography.
02
High grinding efficiency
An optimized abrasive-grinding wheel system that, while ensuring superior surface quality, significantly boosts grinding efficiency and reduces your per-piece labor costs.
03
Extremely low subsurface damage
Our grinding wheel design is engineered to achieve “ultra-precision grinding,” minimizing the subsurface damage layer on the substrate, reducing chipping rates, and improving product yield.
04
High stability and consistency
With the aid of a rigorous quality control system and an MES system, we ensure the high reliability and stability of our product grinding processes.
The particle map shows no obvious wheel marks.
On-site customer testing of the magic mirror for comparison
1
Single-crystal silicon ingot
2
Truncation and rounding
3
Multi-wire cutting
4
One chamfer
5
Double-sided grinding
6
Secondary refining and shaping
8
Polishing
9
Finished polished sheet
Contact Us
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Phone:0571-86129869
Email:xinyanke@dxinyan.com
Address: Building 1, 1st Floor, No. 516 Shunfeng Road, Linping Subdistrict, Linping District, Hangzhou City, Zhejiang Province