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silicon wafer
A key step in chip "slimming down"
Silicon wafer (backside thinning)
Silicon Wafer (Back-Thinning)
A key step in “slimming down” the chip
After chip fabrication is complete, hundreds of micrometers of material must be removed from the back side of the chip, transforming it from a thick “wafer” into a thin and lightweight “chip.” This process is known as back-side thinning, and it directly determines the final chip’s thickness, performance, and reliability.
Why is back-side thinning indispensable?
Achieving chip miniaturization: This is an essential step in manufacturing ultra-thin chips for portable devices such as smartphones, tablets, and smartwatches.
Optimizing Electrical and Thermal Performance: The thin-film design facilitates heat conduction from the front side (circuit side) of the chip to the back side, enhancing thermal dissipation while reducing on-state resistance.
Adapting to Advanced Packaging: For stacked packages (such as PoP) and through-silicon via (TSV) technologies, wafers must be thinned to 100 μm or even below 50 μm.
Incorporated in Hong Kong with Limited Liability
Hangzhou Xin Yan Ke’s technological advantages
From silicon to silicon carbide, from wafers to substrates, we leverage cutting-edge technology to inject outstanding competitiveness into your thinning processes.
01
Stable stair height control
To address potential issues such as edge chipping and central depression that may arise after thinning, we offer customized grinding wheel profiles and grinding process solutions to ensure uniform and consistent wafer thickness across the entire surface.
02
Excellent surface roughness
Our fine-grit grinding wheels can achieve an excellent mirror-like finish in a single grinding pass, reducing or eliminating the need for polishing and shortening the overall process flow.
03
Strong customer process support
We’re not just wheel suppliers—we’re process partners. Our technical team can provide you with a comprehensive suite of solutions, from equipment parameter optimization to yield improvement.
Hangzhou Xinyankexi silicon-based fine-grinding wheel reduces the surface damage layer on silicon wafers after thinning.
Development of Composite Porous Formation Synergistic Technology
1
12-hour silicon wafer
2
Front-end process completed.
3
Coarse grinding and thinning
4
Fine grinding and thinning
5
Backside metallization
6
Wafer dicing
7
Chip mounting
8
Wire bonding
9
Molded plastic encapsulation
Contact Us
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Phone:0571-86129869
Email:xinyanke@dxinyan.com
Address: Building 1, 1st Floor, No. 516 Shunfeng Road, Linping Subdistrict, Linping District, Hangzhou City, Zhejiang Province