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Revolution in Efficiency! Hangzhou XinYanKe has launched a new silicon carbide thinning and rough-grinding wheel, boosting production capacity and accelerating throughput even further!
Dec 24,2025
In the field of silicon carbide processing, “efficiency” and “stability” have always been the core objectives pursued by the industry. Recently, Hangzhou Xin Yan Ke Semiconductor Materials Co., Ltd. launched a new-generation silicon carbide back-side thinning rough grinding wheel (LI-Ⅰ), sparking a revolution in efficiency—its feed rate has surged to 1.2 μm/s, helping customers achieve a dramatic increase in production capacity! 
The feed rate of conventional silicon carbide back-thinning rough-grinding wheels typically ranges from 0.3 to 0.5 μm/s. However, Hangzhou XinYanKe’s new product has boosted this figure to 1.2 μm/s in one go—equivalent to 3 to 4 times the industry’s standard level. Even more crucially, while operating at high speeds, this wheel maintains stable current and keeps the wear ratio within the excellent range of 25% to 30%. 
For silicon carbide wafer processing companies, WPH (wafer throughput per hour) directly determines production capacity and profitability. Thanks to a feed rate that’s 3 to 4 times faster, this grinding wheel enables customers to achieve a leapfrog increase in WPH while maintaining processing quality. It helps customer companies reduce unit processing costs, enhance their market responsiveness, and gain a competitive edge in the fiercely contested industry. 
Traditional Ceramic bond The grinding wheel is “brittle rather than tough,” which accelerates tool breakage and damage, causes current fluctuations, and ultimately reduces efficiency. The R&D team at Hangzhou Xin Yan Ke has deeply cultivated materials science innovation. Their new product adopts an MOF-ceramic binder system, leveraging a dual mechanism of “micropore arrangement + particle reinforcement” to not only enhance the wheel’s toughness and address its inherent brittleness but also ensure its hardness and wear resistance. This makes stable high-speed machining a reality and injects new momentum into the high-quality development of the silicon carbide industry. 
For silicon carbide processing companies seeking breakthroughs in efficiency and production capacity, this grinding wheel—boasting high speed, stability, and wear resistance—is an excellent choice for enhancing core competitiveness. Driven by technological innovation, Hangzhou Xin Yan Ke will continue to launch groundbreaking products in the future. For more details, please follow the official WeChat account of Hangzhou Xin Yan Ke to stay updated on the latest news.
In the field of silicon carbide processing, “efficiency” and “stability” have always been the core objectives pursued by the industry. Recently, Hangzhou Xin Yan Ke Semiconductor Materials Co., Ltd. launched a new-generation silicon carbide back-side thinning rough grinding wheel (LI-Ⅰ), sparking a revolution in efficiency—its feed rate has surged to 1.2 μm/s, helping customers achieve a dramatic increase in production capacity!
The feed rate of conventional silicon carbide back-thinning rough-grinding wheels typically ranges from 0.3 to 0.5 μm/s. However, Hangzhou XinYanKe’s new product has boosted this figure to 1.2 μm/s in one go—equivalent to 3 to 4 times the industry’s standard level. Even more crucially, while operating at high speeds, this wheel maintains stable current and keeps the wear ratio within the excellent range of 25% to 30%.
For silicon carbide wafer processing companies, WPH (wafer throughput per hour) directly determines production capacity and profitability. Thanks to a feed rate that’s 3 to 4 times faster, this grinding wheel enables customers to achieve a leapfrog increase in WPH while maintaining processing quality. It helps customer companies reduce unit processing costs, enhance their market responsiveness, and gain a competitive edge in the fiercely contested industry.
Traditional Ceramic bond The grinding wheel is “brittle rather than tough,” which accelerates tool breakage and damage, causes current fluctuations, and ultimately reduces efficiency. The R&D team at Hangzhou Xin Yan Ke has deeply cultivated materials science innovation. Their new product adopts an MOF-ceramic binder system, leveraging a dual mechanism of “micropore arrangement + particle reinforcement” to not only enhance the wheel’s toughness and address its inherent brittleness but also ensure its hardness and wear resistance. This makes stable high-speed machining a reality and injects new momentum into the high-quality development of the silicon carbide industry.
For silicon carbide processing companies seeking breakthroughs in efficiency and production capacity, this grinding wheel—boasting high speed, stability, and wear resistance—is an excellent choice for enhancing core competitiveness. Driven by technological innovation, Hangzhou Xin Yan Ke will continue to launch groundbreaking products in the future. For more details, please follow the official WeChat account of Hangzhou Xin Yan Ke to stay updated on the latest news.
2025-12-25
The three-day SEMICON China 2025 has successfully concluded at the Shanghai New International Expo Center.
2025-12-25
Hangzhou Xinyanke Semiconductor Materials Co., Ltd. specializes in the R&D, production, and sales of precision grinding, lapping, and polishing products for the semiconductor industry. The company boasts a world-class R&D team and has successfully replaced imported products with its own offerings. Equipped with specialized production and inspection equipment, the company has a production capacity of 30,000 precision semiconductor processing tools and is committed to providing comprehensive solutions for grinding, lapping, and polishing products to customers in the semiconductor industry.
2025-12-25
In the field of silicon carbide processing, “efficiency” and “stability” have always been the core objectives pursued by the industry. Recently, Hangzhou Xin Yan Ke Semiconductor Materials Co., Ltd. launched a new-generation silicon carbide back-side thinning rough grinding wheel (LI-Ⅰ), sparking a revolution in efficiency—its feed rate has surged to 1.2 μm/s, helping customers achieve a dramatic increase in production capacity!
Contact Us
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Phone:0571-86129869
Email:xinyanke@dxinyan.com
Address: Building 1, 1st Floor, No. 516 Shunfeng Road, Linping Subdistrict, Linping District, Hangzhou City, Zhejiang Province