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Problems in the preparation stage of thinning grinding wheels
- Poor match between abrasive and bond. On the one hand, fine-grained diamond micropowders tend to exhibit soft agglomeration, making it difficult to achieve uniform dispersion when mixing micropowders below 2 micrometers, which in turn affects the consistency of grinding wheel performance. On the other hand, the wettability between the binder and the diamond abrasive particles is poor, and some binders themselves lack sufficient mechanical strength—for instance, certain resin binders tend to wear out easily during high-speed grinding, while metal binders can lead to poor self-sharpening of the grinding wheel, preventing new abrasive grains from being exposed in a timely manner. Moreover, it is challenging to refine the particle size of binders; for grinding wheels with particle sizes below 5 micrometers, the current ball-milling process struggles to meet the required fineness standards.
- The internal structure is uneven. The size, distribution, and porosity of pores are difficult to control. If the porosity is too high, it will reduce the strength of the grinding wheel; if it’s too low, chips generated during grinding won’t be able to escape, thereby affecting the machining performance. Moreover, when ultrafine-grained grinding wheels are cold-pressed, the loose bulk density of the powder is high, leading to severe pressure decay and uneven internal structure of the wheel. As a result, subsequent grinding operations may easily cause excessively rapid localized wear.
- Poor batch stability The batch-to-batch quality of diamond micron powder varies significantly, with unstable parameters such as D50 and particle size distribution width. Moreover, insufficient control over process details—including mixing and shaping—results in substantial differences in grinding performance among wheels from different batches, making it impossible to meet the requirements for tool consistency in precision machining.
Problems during the use of thinning grinding wheels
- Abnormal grinding wheel wear When machining extremely hard materials such as silicon carbide, if the wheel porosity and bond formulation are not properly optimized, the wheel wear can far exceed the material removal rate from the workpiece. For example, in one experiment, the ratio of wheel wear to wafer removal was only 1:1.8, which falls significantly short of the requirements for low-cost production. Although adjusting the process parameters can optimize this wear-to-removal ratio to 1:20, prolonged use may still lead to increased wear due to fluctuations in the machining process.
- Prone to slipping and abnormal loading. Some grinding wheels, due to insufficient sharpness, cause the spindle load current to rise rapidly—or even trigger an alarm—upon contact with the workpiece, making it impossible to effectively cut the material. Even if the spindle speed and feed rate are adjusted, there may be no noticeable improvement. Meanwhile, some of the optimized grinding wheels occasionally slip during high-frequency machining, compromising the continuity of the machining process.
- Low grinding efficiency Silicon carbide substrates have high hardness and excellent wear resistance. If the grinding wheel abrasive grains lack sufficient sharpness or if the wheel’s structural design is inappropriate, the grinding time will significantly increase. This not only extends the machining cycle but may also further degrade the machining quality due to the thermal effects generated during prolonged grinding, thereby driving up overall production costs.
Quality issues in machined products caused by thinning grinding wheels
- The machined part has many surface defects. When the abrasive grains on a grinding wheel are unevenly distributed, large particle impurities are present, or debris generated during grinding cannot be promptly removed, scratches will appear on the workpiece surface. Moreover, concentrated grinding stresses can induce subsurface cracks in brittle workpieces such as wafers; silicon carbide wafers may even experience chipping and brittle fracture, severely compromising device performance.
- Dimensional accuracy does not meet the standard. Uneven grinding wheel wear and unstable feed rates of the equipment can lead to excessive variations in the overall workpiece thickness, and may also cause warping or bending. For example, if the thickness of a silicon wafer becomes uneven after thinning, this not only affects subsequent packaging processes but could also result in chipping due to locally weakened areas. Moreover, thermal effects can further compromise machining accuracy, making it impossible to meet the required flatness specifications for the workpiece.
- Poor consistency in batch processing Due to factors such as fluctuations in the grinding wheel’s own performance and subtle changes in process parameters during grinding, surface quality and dimensional accuracy of parts processed in the same batch tend to vary. For products like semiconductor wafers, which demand extremely high consistency, such variations can directly increase the defect rate and lead to substantial economic losses.
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